Thermal Characterization Laboratory (TCL)

Organization
University of California, Santa Cruz, Jack Baskin School of Engineering

Project Leader
Ali Shakouri

Summary
The University of California, Santa Cruz’s quantum electronics group has been researching thermal issues in electronic and optoelectronic devices for the past 10 years. The new, UCSC-sponsored Thermal Characterization Laboratory (TCL) is capitalizing on that foundation through a state-of-the-art facility being built at the ASL to delineate, validate and document the behavior of target materials and devices for a range of temperature profiles of interest. Current TCL research is focused on nanostructured thin films and thermal interface materials. In addition, the TCL is performing thermal imaging of active electronic and optoelectronic devices.

Project Description
Scientists have long known that temperature differences in some materials can produce an electric voltage. This suggests the possibility that this so-called “thermoelectric effect” could be exploited to generate power from all kinds of heat sources. However, the efficiency of such power generation has traditionally been so low that it was not economically viable. Recent advances in nanotechnology have dramatically changed that equation.  

Indeed, a patented thermal imaging technique developed by TCL researches has a resolution far superior to that of existing commercial systems (submicron spatial resolution and 0.006C temperature resolution). Research leading to this breakthrough started with the development by TCL researchers of the first micro-refrigerator-on-a-chip, one of the American Institute of Physics Inventions of the Year (2001). The technique was essential to obtain adequately precise thermal images of the micro-refrigerators, which could not be accomplished using commercial state-of-the-art infrared cameras. The thermal imaging camera has been used in several small and large government-funded projects and various industrial partners have received TCL’s help in assessing the thermal properties of their advanced devices. Recent advances include thermal imaging of active devices in flip-chip configuration through the substrate, and also transient thermal maps with microsecond resolution.

The so-called ‘thermal bottleneck' is one of the major challenges to the semiconductor industry as it pushes into sub-60-nanometer technology and photonic-integrated circuits in high-performance, fiber-optic systems. Some of the most advanced micro-electromechanical systems (MEMS) and biological lab-on-a-chip devices are also very sensitive to temperature. Precise temperature mapping can be used to help optimize such systems. It is anticipated that TCL research will help to identify production and materials defects and optimize material properties, thereby resulting in higher-powered and faster computing and communication systems.

TCL’s research focus aligns closely with that of NASA and ASL affiliate the BIN-RDI. In addition, TCL is an active collaborator with the Center for Nanostructures, a Santa Clara University ASL affiliate, through their TENT program. ASL-affiliation gives the TCL broad access to Silicon Valley and other high-tech companies and the resulting expanded research opportunities.

Sponsored by UCSC’s Jack Baskin School of Engineering, the TCL lead is Ali Shakouri.

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